China RFID Tag Making Machine suppliers

GD Home page Forums General China RFID Tag Making Machine suppliers

This topic contains 0 replies, has 1 voice, and was last updated by  fishi5fi 1 month, 3 weeks ago.

Viewing 1 post (of 1 total)
  • Author
    Posts
  • #536

    fishi5fi
    Participant

    JGDZ-8000B:
    RFID Flip-Chip Bonding Systems are using Visual System to locate the chip and the antenna; make the throughput with almost 99.5% yield. Both models handle all processes in one system platform: antenna web handling, epoxy jetting, flip chip, final curing, and testing; suitable for all types of HF / UHF RFID Inlay.
    Technical Specification:
    Dimensions: JGDZ-8000:6600mm*1500mm*1600mm
    Bonding speed: 5500 UPH (DZJ-8000)
    Power Supply: AC 220V/50HZ
    Power Supply: 7KW
    Bonding accuracy: ±50μm
    Wafer picking: (wafer)6、8、12
    Chip specification: 0.4~2.0mm
    Compressed air: 0.45Mpa~0.6Mpa
    Vacuum pressure: -80Kpa~-100Kpa
    Material bandwidth: 80mm—370mm
    Bound point spacing: ≥20mmChina RFID Tag Making Machine suppliers
    website:http://www.jinguantech.com/rfid-tag-making-machine/

Viewing 1 post (of 1 total)

You must be logged in to reply to this topic.